DESIGN AND CHARACTERIZATION OF A NOVEL ICP PLASMA TOOL FOR HIGH SPEED AND HIGH ACCURACY DRIE PROCESSING

  • Launay N.

Advanced Deep Reactive Ion Etching (DRIE) with high etch rates (30 ?m/min) is achieved by using an etching system with a novel ICP (Inductively Coupled Plasma) source and substrate holder (chuck). Waferstepper dual side lithography (front- to backwafer overlay ? 500 nm) is used to fabricate electrical overlay test structures in order to measure the non-perpendicularity of the etch profile (angular deviation) and the post etch dimension in a through wafer etch process. Compared with a conventional configuration, the angular deviation is reduced from 0.6 ° to a very low value of 0.2 °. Furthermore, the accuracy of through wafer etched features is improved from 0.7 % to 0.1 % (one sigma).

Recent Publications

January 01, 2019

Friendly, appealing or both? Characterising user experience in sponsored search landing pages

  • Bron M.
  • Chute M.
  • Evans H.
  • Lalmas M.
  • Redi M.
  • Silvestri F.

© 2017 International World Wide Web Conference Committee (IW3C2), published under Creative Commons CC BY 4.0 License. Many of today's websites have recognised the importance of mobile friendly pages to keep users engaged and to provide a satisfying user experience. However, next to the experience provided by the sites themselves, ...

January 01, 2019

Analyzing uber's ride-sharing economy

  • Aiello L.
  • Djuric N.
  • Grbovic M.
  • Kooti F.
  • Lerman K.
  • Radosavljevic V.

© 2017 International World Wide Web Conference Committee (IW3C2), published under Creative Commons CC BY 4.0 License. Uber is a popular ride-sharing application that matches people who need a ride (or riders) with drivers who are willing to provide it using their personal vehicles. Despite its growing popularity, there exist ...

January 01, 2019

The paradigm-shift of social spambots: Evidence, theories, and tools for the arms race

  • Cresci S.
  • Petrocchi M.
  • Pietro R.
  • Spognardi A.
  • Tesconi M.

© 2017 International World Wide Web Conference Committee (IW3C2), published under Creative Commons CC BY 4.0 License. Recent studies in social media spam and automation provide anecdotal argumentation of the rise of a new generation of spambots, so-called social spambots. Here, for the first time, we extensively study this novel ...